Telesis Technologies Inc., a world leader in manufacturing standard and customized permanent parts marking equipment and systems, announces a new addition to their E-series line of diode-pumped laser marking systems: the new Telesis EVC Laser System.

Priced aggressively, the small footprint Telesis EVC Laser system allows VANADATE laser technology to enter the “Green Space” required by the latest packaging mandates while serving core markets such as Automotive, Aerospace, and Medical as well.

With new materials such as foils and HDPE plastics becoming the norm for packaging applications, Telesis provides the solution to mark “on-the-fly” at high speeds without burn thru on delicate foils and with contrast on various plastics, as well as, lightning fast marking on chip boards, plastic bottles, and other materials without consumables or ecology issues.

The Telesis EVC features a Q-switched Nd: YVO4 end-pumped laser design with a remote fiber-coupled diode pump source. With average diode life of greater than 25,000 working hours and low replacement cost, the EVC offers the user “best-in-class” reliability with low cost of ownership. To further enhance the “Mark of Confidence” associated with the latest Telesis products, the robust mechanical and optical design allows the Telesis EVC laser to operate in an industrial environment where shock, vibration, and dust are a concern.

Key attributes like deep focal tolerance, high quality small beam diameter, air cooled-no chiller required, stable output power, and DOD complaint, enhance the latest Telesis product release of the EVC laser. Additional enhancements available for packaging applications include integrated PC with touch screen interface, Merlin LS AMI “scan and go” software, quick-posts, and encoder controls.

For more information visit www.telesis.com/industries/packaging.html