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ACiG Technology to distribute KSW Microtec's RFID Thinlam®

Monday, May 11, 2009

MAINZ & DRESDEN, GERMANY — KSW Microtec AG, one of the world¹s leading suppliers of RFID components and inlays for secure cards, documents and other form factors, announced today that the company's Thinlam® has been selected by ACiG Technology to be its primary thin pre-laminated product for high frequency (HF) smartcard applications.

Thomas Hitzer, CEO of KSW stated today: "We are very pleased with this selection by ACiG Technology. It is a real validation of our newly launched and innovative product line to be selected by RFID players like ACiG and we are looking forward to expand our cooperation with ACiG and the Bluehill ID Group in general."

"The KSW Thinlam® product offers unique qualities to our clients so it was a natural choice for us to add the KSW products to our range of RFID inlays," said Anton Witkowski, CEO of ACiG. "We are very happy to work with KSW on promoting this breakthrough technology to our clients in the EMEA region and in the Americas."

The new KSW Thinlam®, with a thickness down to 280µm, sets new standards for card manufacturing. It enables manufacturers to produce HF and UHF RFID cards with more layers, broadening the possibilities to integrate additional security and other high value features into cards. The exceptional thinness is achieved by manufacturing the Thinlam® without chip modules ­ which also results in smoother card surfaces and better printing outcome. Thinlam® maintains the highest durability thanks to its unique patented chip connection technology. In addition, due to the consistently reproducible antenna geometries, KSW Thinlam® achieves tighter resonance frequency tolerances. Thinlam® can be manufactured on PVC, Polycarbonate, PET or Teslin® and can also be used for transparent RFID cards thanks to its excellent optical characteristics.

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